印制電路：printed circuit
印制線路：printed wiring
印制板：printed board
印制板電路：printed circuit board (PCB)
印制線路板：printed wiring board(PWB)
印制元件：printed component
印制接點(diǎn)：printed contact
印制板裝配：printed board assembly
板：board
單面印制板：single-sided printed board(SSB)
雙面印制板：double-sided printed board(DSB)
多層印制板：mulitlayer printed board(MLB)
多層印制電路板：mulitlayer printed circuit board
多層印制線路板：mulitlayer prited wiring board
剛性印制板：rigid printed board
剛性單面印制板：rigid single-sided printed borad
剛性雙面印制板：rigid double-sided printed borad
剛性多層印制板：rigid multilayer printed board
撓性多層印制板：flexible multilayer printed board
撓性印制板：flexible printed board
撓性單面印制板：flexible single-sided printed board
撓性雙面印制板：flexible double-sided printed board
撓性印制電路：flexible printed circuit (FPC)
撓性印制線路：flexible printed wiring
剛性印制板：flex-rigid printed board, rigid-flex printed board
剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
齊平印制板：flush printed board
金屬芯印制板：metal core printed board
金屬基印制板：metal base printed board
多重布線印制板：mulit-wiring printed board
陶瓷印制板：ceramic substrate printed board
導(dǎo)電膠印制板：electroconductive paste printed board
模塑電路板：molded circuit board
模壓印制板：stamped printed wiring board
順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer
散線印制板：discrete wiring board
微線印制板：micro wire board
積層印制板：buile-up printed board
積層多層印制板：build-up mulitlayer printed board (BUM)
積層撓印制板：build-up flexible printed board
表面層合電路板：surface laminar circuit (SLC)
埋入凸塊連印制板：B2it printed board
多層膜基板：multi-layered film substrate(MFS)
層間全內(nèi)導(dǎo)通多層印制板：ALIVH multilayer printed board
載芯片板：chip on board (COB)
埋電阻板：buried resistance board
母板：mother board
子板：daughter board
背板：backplane
裸板：bare board
鍵盤板夾心板：copper-invar-copper board
動態(tài)撓性板：dynamic flex board
靜態(tài)撓性板：static flex board
可斷拼板：break-away planel
電纜：cable
撓性扁平電纜：flexible flat cable (FFC)
薄膜開關(guān)：membrane switch
混合電路：hybrid circuit
厚膜：thick film
厚膜電路：thick film circuit
薄膜：thin film
薄膜混合電路：thin film hybrid circuit
互連：interconnection
導(dǎo)線：conductor trace line
齊平導(dǎo)線：flush conductor
傳輸線：transmission line
跨交：crossover
板邊插頭：edge-board contact
增強(qiáng)板：stiffener
基底：substrate
基板面：real estate
導(dǎo)線面：conductor side
元件面：component side
焊接面：solder side
印制：printing
網(wǎng)格：grid
圖形：pattern
導(dǎo)電圖形：conductive pattern
非導(dǎo)電圖形：non-conductive pattern
字符：legend
標(biāo)志：mark
二 基材：
基材：base material
層壓板：laminate
覆金屬箔基材：metal-clad bade material
覆銅箔層壓板：copper-clad laminate (CCL)
單面覆銅箔層壓板：single-sided copper-clad laminate
雙面覆銅箔層壓板：double-sided copper-clad laminate
復(fù)合層壓板：composite laminate
薄層壓板：thin laminate
金屬芯覆銅箔層壓板：metal core copper-clad laminate
金屬基覆銅層壓板：metal base copper-clad laminate
撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
基體材料：basis material
預(yù)浸材料：prepreg
粘結(jié)片：bonding sheet
預(yù)浸粘結(jié)片：preimpregnated bonding sheer
環(huán)氧玻璃基板：epoxy glass substrate
加成法用層壓板：laminate for additive process
預(yù)制內(nèi)層覆箔板：mass lamination panel
內(nèi)層芯板：core material
催化板材：catalyzed board ,coated catalyzed laminate
涂膠催化層壓板：adhesive-coated catalyzed laminate
涂膠無催層壓板：adhesive-coated uncatalyzed laminate
粘結(jié)層：bonding layer
粘結(jié)膜：film adhesive
涂膠粘劑絕緣薄膜：adhesive coated dielectric film
無支撐膠粘劑膜：unsupported adhesive film
覆蓋層：cover layer (cover lay)
增強(qiáng)板材：stiffener material
銅箔面：copper-clad surface
去銅箔面：foil removal surface
層壓板面：unclad laminate surface
基膜面：base film surface
膠粘劑面：adhesive faec
原始光潔面：plate finish
粗面：matt finish
縱向：length wise direction
模向：cross wise direction
剪切板：cut to size panel
酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates
聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
超薄型層壓板：ultra thin laminate
陶瓷基覆銅箔板：ceramics base copper-clad laminates
紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
三 基材的材料
A階樹脂：A-stage resin
B階樹脂：B-stage resin
C階樹脂：C-stage resin
環(huán)氧樹脂：epoxy resin
酚醛樹脂：phenolic resin
聚酯樹脂：polyester resin
聚酰亞胺樹脂：polyimide resin
雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin
丙烯酸樹脂：acrylic resin
三聚氰胺甲醛樹脂：melamine formaldehyde resin
多官能環(huán)氧樹脂：polyfunctional epoxy resin
溴化環(huán)氧樹脂：brominated epoxy resin
環(huán)氧酚醛：epoxy novolac
氟樹脂：fluroresin
硅樹脂：silicone resin
硅烷：silane
聚合物：polymer
無定形聚合物：amorphous polymer
結(jié)晶現(xiàn)象：crystalline polamer
雙晶現(xiàn)象：dimorphism
共聚物：copolymer
合成樹脂：synthetic
熱固性樹脂：thermosetting resin
熱塑性樹脂：thermoplastic resin
感光性樹脂：photosensitive resin
環(huán)氧當(dāng)量：weight per epoxy equivalent (WPE)
環(huán)氧值：epoxy value
雙氰胺：dicyandiamide
粘結(jié)劑：binder
膠粘劑：adesive
固化劑：curing agent
阻燃劑：flame retardant
遮光劑：opaquer
增塑劑：plasticizers
不飽和聚酯：unsatuiated polyester
聚酯薄膜：polyester
聚酰亞胺薄膜：polyimide film (PI)
聚四氟乙烯：polytetrafluoetylene (PTFE)
聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
增強(qiáng)材料：reinforcing material
玻璃纖維：glass fiber
E玻璃纖維：E-glass fibre
D玻璃纖維：D-glass fibre
S玻璃纖維：S-glass fibre
玻璃布：glass fabric
非織布：non-woven fabric
玻璃纖維墊：glass mats
紗線：yarn
單絲：filament
絞股：strand
緯紗：weft yarn
經(jīng)紗：warp yarn
但尼爾：denier
經(jīng)向：warp-wise
緯向：weft-wise, filling-wise
織物經(jīng)緯密度：thread count
織物組織：weave structure
平紋組織：plain structure
壞布：grey fabric
稀松織物：woven scrim
弓緯：bow of weave
斷經(jīng)：end missing
缺緯：mis-picks
緯斜：bias
折痕：crease
云織：waviness
魚眼：fish eye
毛圈長：feather length
厚薄段：mark
裂縫：split
捻度：twist of yarn
浸潤劑含量：size content
浸潤劑殘留量：size residue
處理劑含量：finish level
浸潤劑：size
偶聯(lián)劑：couplint agent
處理織物：finished fabric
聚酰胺纖維：polyarmide fiber
聚酯纖維非織布：non-woven polyester fabric
浸漬絕緣縱紙：impregnating insulation paper
聚芳酰胺纖維紙：aromatic polyamide paper
斷裂長：breaking length
吸水高度：height of capillary rise
濕強(qiáng)度保留率：wet strength retention
白度：whitenness
陶瓷：ceramics
導(dǎo)電箔：conductive foil
銅箔：copper foil
電解銅箔：electrodeposited copper foil (ED copper foil)
壓延銅箔：rolled copper foil
退火銅箔：annealed copper foil
壓延退火銅箔：rolled annealed copper foil (RA copper foil)
薄銅箔：thin copper foil
涂膠銅箔：adhesive coated foil
涂膠脂銅箔：resin coated copper foil (RCC)
復(fù)合金屬箔：composite metallic material
載體箔：carrier foil
殷瓦：invar
箔（剖面）輪廓：foil profile
光面：shiny side
粗糙面：matte side
處理面：treated side
防銹處理：stain proofing
雙面處理銅箔：double treated foil
四 設(shè)計(jì)
原理圖：shematic diagram
邏輯圖：logic diagram
印制線路布設(shè)：printed wire layout
布設(shè)總圖：master drawing
可制造性設(shè)計(jì)：design-for-manufacturability
計(jì)算機(jī)輔助設(shè)計(jì)：computer-aided design.(CAD)
計(jì)算機(jī)輔助制造：computer-aided manufacturing.(CAM)
計(jì)算機(jī)集成制造：computer integrat manufacturing.(CIM)
計(jì)算機(jī)輔助工程：computer-aided engineering.(CAE)
計(jì)算機(jī)輔助測試：computer-aided test.(CAT)
電子設(shè)計(jì)自動化：electric design automation .(EDA)
工程設(shè)計(jì)自動化：engineering design automaton .(EDA2)
組裝設(shè)計(jì)自動化：assembly aided architectural design. (AAAD)
計(jì)算機(jī)輔助制圖：computer aided drawing
計(jì)算機(jī)控制顯示：computer controlled display .(CCD)
布局：placement
布線：routing
布圖設(shè)計(jì)：layout
重布：rerouting
模擬：simulation
邏輯模擬：logic simulation
電路模擬：circit simulation
時(shí)序模擬：timing simulation
模塊化：modularization
布線完成率：layout effeciency
機(jī)器描述格式：machine descriptionm format .(MDF)
機(jī)器描述格式數(shù)據(jù)庫：MDF databse
設(shè)計(jì)數(shù)據(jù)庫：design database
設(shè)計(jì)原點(diǎn)：design origin
優(yōu)化（設(shè)計(jì)）：optimization (design)
供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominant axis
表格原點(diǎn)：table origin
鏡像：mirroring
驅(qū)動文件：drive file
中間文件：intermediate file
制造文件：manufacturing documentation
隊(duì)列支撐數(shù)據(jù)庫：queue support database
元件安置：component positioning
圖形顯示：graphics dispaly
比例因子：scaling factor
掃描填充：scan filling
矩形填充：rectangle filling
填充域：region filling
實(shí)體設(shè)計(jì)：physical design
邏輯設(shè)計(jì)：logic design
邏輯電路：logic circuit
層次設(shè)計(jì)：hierarchical design
自頂向下設(shè)計(jì)：top-down design
自底向上設(shè)計(jì)：bottom-up design
線網(wǎng)：net
數(shù)字化：digitzing
設(shè)計(jì)規(guī)則檢查：design rule checking
走（布）線器：router (CAD)
網(wǎng)絡(luò)表：net list
計(jì)算機(jī)輔助電路分析：computer-aided circuit analysis
子線網(wǎng)：subnet
目標(biāo)函數(shù)：objective function
設(shè)計(jì)后處理：post design processing (PDP)
交互式制圖設(shè)計(jì)：interactive drawing design
費(fèi)用矩陣：cost metrix
工程圖：engineering drawing
方塊框圖：block diagram
迷宮：moze
元件密度：component density
巡回售貨員問題：traveling salesman problem
自由度：degrees freedom
入度：out going degree
出度：incoming degree
曼哈頓距離：manhatton distance
歐幾里德距離：euclidean distance
網(wǎng)絡(luò)：network
陣列：array
段：segment
邏輯：logic
邏輯設(shè)計(jì)自動化：logic design automation
分線：separated time
分層：separated layer
定順序：definite sequence
五 形狀與尺寸：
導(dǎo)線（通道）：conduction (track)
導(dǎo)線（體）寬度：conductor width
導(dǎo)線距離：conductor spacing
導(dǎo)線層：conductor layer
導(dǎo)線寬度/間距：conductor line/space
第一導(dǎo)線層：conductor layer No.1
圓形盤：round pad
方形盤：square pad
菱形盤：diamond pad
長方形焊盤：oblong pad
子彈形盤：bullet pad
淚滴盤：teardrop pad
雪人盤：snowman pad
V形盤：V-shaped pad
環(huán)形盤：annular pad
非圓形盤：non-circular pad
隔離盤：isolation pad
非功能連接盤：monfunctional pad
偏置連接盤：offset land
腹（背）裸盤：back-bard land
盤址：anchoring spaur
連接盤圖形：land pattern
連接盤網(wǎng)格陣列：land grid array
孔環(huán)：annular ring
元件孔：component hole
安裝孔：mounting hole
支撐孔：supported hole
非支撐孔：unsupported hole
導(dǎo)通孔：via
鍍通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)
全部鉆孔：all drilled hole
定位孔：toaling hole
無連接盤孔：landless hole
中間孔：interstitial hole
無連接盤導(dǎo)通孔：landless via hole
引導(dǎo)孔：pilot hole
端接全隙孔：terminal clearomee hole
準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole
準(zhǔn)尺寸孔：dimensioned hole
在連接盤中導(dǎo)通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔圖：hole pattern
鉆孔圖：drill drawing
裝配圖：assembly drawing
印制板組裝圖：printed board assembly drawing
參考基準(zhǔn)：datum referan